Male connector
Reflow soldering termination (THR), Wave soldering termination
Rated current: 1 A
Contacts: 160
Angled
Copper alloy
Noble metal over Ni Mating side (Rows z and d), Au over NiP over Ni Mating side (Rows a,b and c), Sn over Ni Termination side
Performance level: 2, acc. to IEC 61076-4-113
PCB fixing: With fixing flange
Liquid crystal polymer (LCP)
Beige
Product details
Category
Connectors
Series
har-bus® 64
Element
Male connector
Description of the contact
Angled
Termination method
Reflow soldering termination (THR)
Wave soldering termination
Connection type
Motherboard to daughtercard
Extender card
Number of contacts
160
Contact configuration
Rows z, a, b, c, and d, positions 1, 2, ... , 31, 32
Leading contact on position
d1
d2
d31
d32
PCB fixing
With fixing flange
Contact rows
5
Contact spacing (termination side)
2.54 mm
Contact spacing (mating side)
2.54 mm
Rated current
1 A
Rated current
Rated current measured at 20 °C, see derating curve for details
Clearance distance
1.2 mm between 2 rows (a, b, c)
1.2 mm between 2 rows (z, d)
1.2 mm between 2 contacts in a row (a, b, c)
1 mm between 2 contacts in a row (z, d)
Creepage distance
1.2 mm between 2 rows (a, b, c)
1.2 mm between 2 rows (z, d)
1.2 mm between 2 contacts in a row (a, b, c)
1 mm between 2 contacts in a row (z, d)
Insulation resistance
>1010 Ω
Contact resistance
≤20 mΩ for rows a, b, c
≤30 mΩ for rows z, d
Limiting temperature
-55 ... +125 °C (during reflow soldering max. +240 °C for 20 s)
