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| Version | ||
|---|---|---|
| Pack contents | Sample | 250 pieces on reel |
| Connection type | Motherboard to daughtercard|Mezzanine|PCB to cable | Motherboard to daughtercard|Mezzanine|PCB to cable |
| Number of contacts | 12 | 12 |
| Termination method | Reflow soldering termination (SMT) | Reflow soldering termination (SMT) |
| Specifications and approvals | ||
| UL / CSA | UL 1977 ECBT2.E102079 | UL 1977 ECBT2.E102079 |
| Technical characteristics | ||
| Mating cycles | 500 | 500 |
| Isolation group | IIIa (175 ≤ CTI 400) | IIIa (175 ≤ CTI 400) |
| Performance level | 1 | 1 |
| Test voltage Ur.m.s. | 0.5 kV | 0.5 kV |
| Creepage distance | 0.4 mm | 0.4 mm |
| Clearance distance | 0.4 mm | 0.4 mm |
| Withdrawal force | 1.8 N|8.4 N | 1.8 N|8.4 N |
| Insertion force | 9.6 N | 9.6 N |
| Contact spacing (mating side) | 1.27 mm | 1.27 mm |
| Contact resistance | 25 mΩ | 25 mΩ |
| Limiting temperature | -55 ... +125 °C | -55 ... +125 °C |
| Contact spacing (termination side) | 1.27 mm | 1.27 mm |
| Identification | ||
| Description of the contact | Straight | Straight |
| Element | Male connector | Male connector |
| Identification | Signal | Signal |
| Series | har-flex® | har-flex® |
| Features | The sample packaging is not suitable for automated assembly. | |
| Material properties | ||
| Material (contacts) | Copper alloy | Copper alloy |
| Surface (contacts) | Noble metal over Ni Mating side|Sn over Ni Termination side | Noble metal over Ni Mating side|Sn over Ni Termination side |
| Material (insert) | Liquid crystal polymer (LCP) | Liquid crystal polymer (LCP) |