har-flex str m 3.25mm 20p PL1

Article No.: 15 12 020 2601 333

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Male connector

Article No.: 15 12 020 2601 333

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Male connector

Reflow soldering termination (SMT)

Contacts: 20

Straight

Copper alloy

Noble metal over Ni Mating side, Sn over Ni Termination side

Performance level: 1

Liquid crystal polymer (LCP)

Identification

Category	Connectors
Series	har-flex^®
Identification	Signal
Element	Male connector
Description of the contact	Straight
Features	The sample packaging is not suitable for automated assembly.

Version

Termination method	Reflow soldering termination (SMT)
Connection type	Motherboard to daughtercard
	Mezzanine
	PCB to cable
Number of contacts	20
Pack contents	Sample

Technical characteristics

Contact rows	2
Contact spacing (termination side)	1.27 mm
Contact spacing (mating side)	1.27 mm
Stacking height	3.25 mm
Clearance distance	≥ 0.4 mm
Creepage distance	≥ 0.4 mm
Insulation resistance	>10⁹ Ω
Contact resistance	< 25 mΩ
Limiting temperature	-55 ... +125 °C
Insertion force	≤ 16 N
Withdrawal force	≥ 3 N
Withdrawal force	≤ 14 N
Performance level	1
Mating cycles	≥ 500
Test voltage Ur.m.s.	0.5 kV
Isolation group	IIIa (175 ≤ CTI < 400)

Material properties

Material (insert)	Liquid crystal polymer (LCP)
Material (contacts)	Copper alloy
Surface (contacts)	Noble metal over Ni Mating side
Surface (contacts)	Sn over Ni Termination side
Material flammability class acc. to UL 94	V-0
RoHS	compliant
ELV status	compliant
China RoHS	e
REACH Annex XVII substances	Not contained
REACH ANNEX XIV substances	Not contained
REACH SVHC substances	Not contained
California Proposition 65 substances	Not contained

Specifications and approvals

UL / CSA	UL 1977 ECBT2.E102079
UL / CSA	CSA-C22.2 No. 182.3 ECBT8.E102079

Commercial data

Packaging size	1
Net weight	14 g
Country of origin	China
European customs tariff number	85366990
GTIN	5713140116672
eCl@ss	27460201 PCB connector (board connector)
ETIM	EC002637
UNSPSC 24.0	39121415