Better Connectivity in the Small Footprints of Semiconductor Manufacturing

Semiconductor fabs are under pressure to deliver more output, more reliability, and more intelligence within increasingly compact footprints. High-power connectors are being tasked to be more efficient within less space. (8 min. watch | 11 min. read)

Top Talking Points

Semiconductor fabs must deliver more output, better uptime reliability, and smarter operations systems within smaller footprints

Smarter machines require more sensors, diagnostics, and control systems to boost yield and efficiency

Adding intelligence increases design complexity, especially in space-constrained, high-cost cleanroom environments

Modular connectors simplify infrastructure by combining power, signal, and data into one interface

Some challenges can be addressed with standard, off-the-shelf components, while others require custom-engineered solutions

HARTING is a trusted partner for connectivity from large power systems to board-level components

Building the Brains Behind the Connected World

Semiconductor chips can be found in devices used to improve everyday life. From smartphones and smartwatches to autonomous vehicles and AI servers, chips are everywhere. In fact, the average person is never more than two feet away from a device containing a semiconductor chip.

The global semiconductor market is projected to reach $1 trillion by 2030, driven by demand for high-performance computing, IoT, and AI. But with this growth comes complexity.

To keep up with the demand for these chips, semiconductor manufacturing equipment must:

Handle higher throughput
Maintain tighter tolerances
Integrate more sensors and control systems

Increasing yield without expanding the equipment footprint requires smarter, more efficient machines. That means more temperature sensors, pressure monitors, vision systems, and predictive diagnostics—all working in harmony to reduce flaws and boost efficiency.

Engineering Intelligence Into Every Square Foot

When we talk about adding intelligence, it's not just about adding more devices. We also need to think about the infrastructure that keeps everything running, like the power, signal, and data connections for every sensor, actuator, and control system. More cables and more connectors lead to a more complex design.

Space in semiconductor fabs is extremely limited and expensive. According to industry estimates, cleanroom space can cost $1,000 to $10,000 per square foot. That’s why engineers are constantly challenged to:

Shrink equipment footprints
Optimize cable routing
Minimize installation time

At HARTING, we embrace these challenges. Whether it’s reducing connector size or combining multiple functions into a single hybrid interface, we help engineers maximize performance without compromising space.

Simplifying Industrial Connections with Modular Innovation

Modular connectors simplify complexity. Just like HDMI replaced RCA cables in consumer electronics, modular industrial connectors consolidate multiple functions into a single interface.
Modular connectors offer:

Space savings through higher contact density
Flexibility with mix-and-match modules
Time savings with plug-and-play installation

This approach is especially valuable in mission-critical environments where uptime, reliability, and scalability are non-negotiable.

Case Study: Streamlined Connectivity with Hybrid Connector

In one real-world example, HARTING helped a customer replace 10 separate signal cables, multiple power lines, and pneumatic connections with a single modular connector.

This streamlined solution reduced supply chain complexity and shortened installation time, transforming a complicated set-up into a clean, efficient interface.

How Do You Solve These Design Challenges?

Solving these challenges takes more than just having the right products. It takes the right partners. Some issues can be handled with off-the-shelf solutions, but others need custom engineering. That’s why HARTING provides options tailored to both:

A full product development team
Dedicated R&D engineers
Collaborative design support

We start by asking the right questions:

Are you transmitting power, signal, or data?
What are your space constraints?
Do you need to meet industry standards like SEMI or IPC?

Then we build the correct solutions together. Our engineers love a challenge, and we’re proud to co-create with customers to push the boundaries of what connectors can do.

Whether you want full engineering support or prefer to build your own solution. HARTING has the experience and expertise to help guide the solutioning process.

Our Field Application Engineers help you design and spec your system
HARTING Product Configurators lets you create 3D models and BOMs online
Our website offers drawings, 3D models, and product comparisons
We support both collaborative and DIY engineering workflows, so you can move fast and stay flexible

Meeting the Needs of Modern Fabs

Our Han-Modular® and Han-Eco® lines are purpose-built for high-density, high-performance environments like semiconductor fabs.

Key features include:

LEGO-like modularity: Combine power, signal, data, and pneumatics in one connector
Material flexibility: Choose plastic, metal, or stainless steel housings
Miniaturization options: Use half-modules (Domino modules) to optimize space

These connectors are designed to meet the demands of modern semiconductor equipment: